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  FPC - Rigid-Flex Circuit + HDI, Multi-layer, Double side, Single-side Design


Communication - C: Rigid-Flex Circuit Design
 
 
Application
:
Auto CCD (Rigid Flex)
Description
:
4- Layers
Material Base Film
:
1 mil with 1/2 oz Cu
Cover Film
:
1/2 mil
Finished
:
Au / Ni
L/S
:
4 / 4 mil
 
..................................................................................................................................
 
Application
:
Camera Module (Rigid Flex)
Description
:
4- Layers
Material Base Film
:
1 mil with 1/2 oz Cu
Cover Film
:
1/2 mil
Finished
:
Au / Ni
L/S
:
4 / 4 mil
 
..................................................................................................................................
 
Application
:
Camera Module (Rigid Flex)
Description
:
4- Layers
Material Base Film
:
1 mil with 1/2 oz Cu
Cover Film
:
1/2 mil
Finished
:
Au / Ni
L/S
:
4 / 4 mil