|
|
|
|
| |
| Application |
: |
Cell Phone Hing Main Board (R/F + Air Gap) |
| Description |
: |
6- Layers |
| Material Base Film |
: |
1 mil with 1/2 oz Cu |
| Cover Film |
: |
1/2 mil |
| Finished |
: |
Au / Ni |
| L/S |
: |
3 / 3 mil |
|
|
|
|
|
.................................................................................................................................. |
|
| |
| Application |
: |
Portable Device (Rigid Flex + HDI) |
| Description |
: |
8- Layers |
| Material Base Film |
: |
1 mil with 1/2 oz Cu |
| Cover Film |
: |
1 mil |
| Finished |
: |
Au / Ni |
| L/S |
: |
4 / 4 mil |
|
|
|
|
|
.................................................................................................................................. |
|
| |
| Application |
: |
Key Pad (Rigid Flex) |
| Description |
: |
4- Layers |
| Material Base Film |
: |
1 mil with 1/3 oz Cu |
| Cover Film |
: |
1/2 mil |
| Finished |
: |
Au / Ni |
| L/S |
: |
4 / 4 mil |
|
|
|
|
| |
|
|
